<article>
<table>
<tbody>
<tr>
<td>Предназначен за</td>
<td>Охлаждащи системи</td>
</tr>
<tr>
<td>Х-ка 2</td>
<td>TG-30 is a premium thermal compound for high standard cooling
performance designed to lower CPU temperatures effectively.</td>
</tr>
<tr>
<td>Х-ка 3</td>
<td>The thermal compound contains diamond powder, which would provide a
thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary
needs.</td>
</tr>
<tr>
<td>Х-ка 4</td>
<td>Density: 2.55 g/cm3</td>
</tr>
<tr>
<td>Х-ка 5</td>
<td>Viscosity: 76 Pa-s</td>
</tr>
<tr>
<td>Х-ка 6</td>
<td>Thermal impedance: 0.185°C -in2/W</td>
</tr>
<tr>
<td>Х-ка 7</td>
<td>Thermaltake’s specially formulated thermal compound fits
perfectly with the honeycomb stencil, which provides an easier way to apply your
thermal compound for a neat and well-covered surface that fits all
CPUs.</td>
</tr>
<tr>
<td>Х-ка 8</td>
<td>The high-quality thermal compound provides a longer lifespan of
eliminating dry-out or cracking while in use. Non-electrical conductive compound
ensures better safety measures for you and your system.</td>
</tr>
</tbody>
</table>
</article>