Термо паста Thermaltake TG-50 4G
Сходни продукти (16)
Параметри и описание
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<td>Предназначен за</td>
<td>Охлаждащи системи</td>
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<td>Х-ка 2</td>
<td>TG-50 is a premium thermal compound for high standard cooling
performance designed to lower CPU temperatures effectively.</td>
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<td>Х-ка 3</td>
<td>With a thermal conductivity of 8.0 W/m-k, the thermal compound also
contains diamonds powder allowing users to pursue a higher heat transfer
rate.</td>
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<td>Х-ка 4</td>
<td>Density: 2.9 g/cm3</td>
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<td>Х-ка 5</td>
<td>Viscosity: 47 Pa-s</td>
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<td>Х-ка 6</td>
<td>Thermal impedance: 0.035°C -in2/W</td>
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<td>Х-ка 7</td>
<td>Thermaltake’s specially formulated thermal compound fits
perfectly with the honeycomb stencil, which provides an easier way to apply your
thermal compound for a neat and well-covered surface that fits all
CPUs.</td>
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<td>Х-ка 8</td>
<td>This thermal compound application kit includes a set of easily-applied
tools for immediate use.</td>
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